“GPU temperature and clocks remain within limits under extended load” addresses thermal interface material does not meet approved contact and resistance requirements, but the current hardware or infrastructure issue is the GPU power connection and supply budget are incomplete. The option “board power status is healthy and full-load draw stays within limits” is more directly tied to the required outcome.

“approved service checklist shows power isolation before any board handling” addresses physical GPU servicing omitted safe shutdown and isolation prerequisites, but the current hardware or infrastructure issue is the GPU power connection and supply budget are incomplete. The option “board power status is healthy and full-load draw stays within limits” is more directly tied to the required outcome.

“lspci reports expected link width and cooling sensors remain healthy” addresses installation slot choice violates platform mechanical and electrical constraints, but the current hardware or infrastructure issue is the GPU power connection and supply budget are incomplete. The option “board power status is healthy and full-load draw stays within limits” is more directly tied to the required outcome.

“reseat the GPU using documented retention and torque procedures” addresses card retention and connector seating were not completed to the platform standard, but the current hardware or infrastructure issue is physical compatibility and airflow clearance were not confirmed. The option “use the platform-qualified board form factor and carrier assembly” is more directly tied to the required outcome.

“use the qualified GPU slot and retention hardware specified for the chassis” addresses installation slot choice violates platform mechanical and electrical constraints, but the current hardware or infrastructure issue is physical compatibility and airflow clearance were not confirmed. The option “use the platform-qualified board form factor and carrier assembly” is more directly tied to the required outcome.

“complete chassis service closure with fans panels and diagnostic tests” addresses physical reassembly and cooling acceptance were skipped, but the current hardware or infrastructure issue is physical compatibility and airflow clearance were not confirmed. The option “use the platform-qualified board form factor and carrier assembly” is more directly tied to the required outcome.

“thermal stress run and hardware inspections meet post-service acceptance” addresses physical reassembly and cooling acceptance were skipped, but the current hardware or infrastructure issue is physical compatibility and airflow clearance were not confirmed. The option “chassis fit check and fan telemetry satisfy service specifications” is more directly tied to the required outcome.

“discovered UUID and serial match the approved replacement record” addresses hardware replacement identity and logical inventory were not reconciled, but the current hardware or infrastructure issue is physical compatibility and airflow clearance were not confirmed. The option “chassis fit check and fan telemetry satisfy service specifications” is more directly tied to the required outcome.

“service documentation confirms qualified ESD controls and post-install diagnostics pass” addresses electrostatic-discharge handling requirements were ignored, but the current hardware or infrastructure issue is physical compatibility and airflow clearance were not confirmed. The option “chassis fit check and fan telemetry satisfy service specifications” is more directly tied to the required outcome.

“power down and isolate the node following the qualified service procedure” addresses physical GPU servicing omitted safe shutdown and isolation prerequisites, but the current hardware or infrastructure issue is high-speed intra-node GPU cabling was omitted during hardware assembly. The option “reinstall and validate the specified GPU interconnect hardware” is more directly tied to the required outcome.

“reseat the GPU using documented retention and torque procedures” addresses card retention and connector seating were not completed to the platform standard, but the current hardware or infrastructure issue is high-speed intra-node GPU cabling was omitted during hardware assembly. The option “reinstall and validate the specified GPU interconnect hardware” is more directly tied to the required outcome.

“use the platform-qualified board form factor and carrier assembly” addresses physical compatibility and airflow clearance were not confirmed, but the current hardware or infrastructure issue is high-speed intra-node GPU cabling was omitted during hardware assembly. The option “reinstall and validate the specified GPU interconnect hardware” is more directly tied to the required outcome.

“lspci reports expected link width and cooling sensors remain healthy” addresses installation slot choice violates platform mechanical and electrical constraints, but the current hardware or infrastructure issue is high-speed intra-node GPU cabling was omitted during hardware assembly. The option “link topology and peer bandwidth reflect all required links” is more directly tied to the required outcome.

“discovered UUID and serial match the approved replacement record” addresses hardware replacement identity and logical inventory were not reconciled, but the current hardware or infrastructure issue is high-speed intra-node GPU cabling was omitted during hardware assembly. The option “link topology and peer bandwidth reflect all required links” is more directly tied to the required outcome.

“repeated boot and stress testing shows stable GPU enumeration” addresses card retention and connector seating were not completed to the platform standard, but the current hardware or infrastructure issue is high-speed intra-node GPU cabling was omitted during hardware assembly. The option “link topology and peer bandwidth reflect all required links” is more directly tied to the required outcome.

Useful for physical reassembly and cooling acceptance were skipped, but it does not remove the specific condition: electrostatic-discharge handling requirements were ignored.

“use the platform-qualified board form factor and carrier assembly” addresses physical compatibility and airflow clearance were not confirmed, but the current hardware or infrastructure issue is electrostatic-discharge handling requirements were ignored. The option “enforce grounded ESD practices during accelerator installation” is more directly tied to the required outcome.

“update asset mapping using GPU UUID bus ID and chassis slot” addresses hardware replacement identity and logical inventory were not reconciled, but the current hardware or infrastructure issue is electrostatic-discharge handling requirements were ignored. The option “enforce grounded ESD practices during accelerator installation” is more directly tied to the required outcome.

“chassis fit check and fan telemetry satisfy service specifications” addresses physical compatibility and airflow clearance were not confirmed, but the current hardware or infrastructure issue is electrostatic-discharge handling requirements were ignored. The option “service documentation confirms qualified ESD controls and post-install diagnostics pass” is more directly tied to the required outcome.

“thermal stress run and hardware inspections meet post-service acceptance” addresses physical reassembly and cooling acceptance were skipped, but the current hardware or infrastructure issue is electrostatic-discharge handling requirements were ignored. The option “service documentation confirms qualified ESD controls and post-install diagnostics pass” is more directly tied to the required outcome.

“repeated boot and stress testing shows stable GPU enumeration” addresses card retention and connector seating were not completed to the platform standard, but the current hardware or infrastructure issue is electrostatic-discharge handling requirements were ignored. The option “service documentation confirms qualified ESD controls and post-install diagnostics pass” is more directly tied to the required outcome.

“reseat the GPU using documented retention and torque procedures” addresses card retention and connector seating were not completed to the platform standard, but the current hardware or infrastructure issue is hardware replacement identity and logical inventory were not reconciled. The option “update asset mapping using GPU UUID bus ID and chassis slot” is more directly tied to the required outcome.

“use the qualified GPU slot and retention hardware specified for the chassis” addresses installation slot choice violates platform mechanical and electrical constraints, but the current hardware or infrastructure issue is hardware replacement identity and logical inventory were not reconciled. The option “update asset mapping using GPU UUID bus ID and chassis slot” is more directly tied to the required outcome.

Useful for physical reassembly and cooling acceptance were skipped, but it does not remove the specific condition: hardware replacement identity and logical inventory were not reconciled.

“chassis fit check and fan telemetry satisfy service specifications” addresses physical compatibility and airflow clearance were not confirmed, but the current hardware or infrastructure issue is hardware replacement identity and logical inventory were not reconciled. The option “discovered UUID and serial match the approved replacement record” is more directly tied to the required outcome.

“repeated boot and stress testing shows stable GPU enumeration” addresses card retention and connector seating were not completed to the platform standard, but the current hardware or infrastructure issue is hardware replacement identity and logical inventory were not reconciled. The option “discovered UUID and serial match the approved replacement record” is more directly tied to the required outcome.

“GPU temperature and clocks remain within limits under extended load” addresses thermal interface material does not meet approved contact and resistance requirements, but the current hardware or infrastructure issue is hardware replacement identity and logical inventory were not reconciled. The option “discovered UUID and serial match the approved replacement record” is more directly tied to the required outcome.

Useful for physical GPU servicing omitted safe shutdown and isolation prerequisites, but it does not remove the specific condition: physical reassembly and cooling acceptance were skipped.

“update asset mapping using GPU UUID bus ID and chassis slot” addresses hardware replacement identity and logical inventory were not reconciled, but the current hardware or infrastructure issue is physical reassembly and cooling acceptance were skipped. The option “complete chassis service closure with fans panels and diagnostic tests” is more directly tied to the required outcome.

“use the platform-qualified board form factor and carrier assembly” addresses physical compatibility and airflow clearance were not confirmed, but the current hardware or infrastructure issue is physical reassembly and cooling acceptance were skipped. The option “complete chassis service closure with fans panels and diagnostic tests” is more directly tied to the required outcome.

“repeated boot and stress testing shows stable GPU enumeration” addresses card retention and connector seating were not completed to the platform standard, but the current hardware or infrastructure issue is physical reassembly and cooling acceptance were skipped. The option “thermal stress run and hardware inspections meet post-service acceptance” is more directly tied to the required outcome.

“chassis fit check and fan telemetry satisfy service specifications” addresses physical compatibility and airflow clearance were not confirmed, but the current hardware or infrastructure issue is physical reassembly and cooling acceptance were skipped. The option “thermal stress run and hardware inspections meet post-service acceptance” is more directly tied to the required outcome.

“board power status is healthy and full-load draw stays within limits” addresses the GPU power connection and supply budget are incomplete, but the current hardware or infrastructure issue is physical reassembly and cooling acceptance were skipped. The option “thermal stress run and hardware inspections meet post-service acceptance” is more directly tied to the required outcome.